11/30/2020

Kaneka Develops Super Heat-Resistant Polyimide Film for 5G Millimeter Wave Zones

Kaneka Corporation (TOKYO: 4118) (Headquarters: Minato-ku, Tokyo; President: Minoru Tanaka) has developed “PixeoTM*1IB”, a super heat-resistant polyimide film for high-speed, high frequency 5G*2. The offering of samples began in October, and a full-scale rollout is scheduled for 2021. “PixeoTM IB” reduces the dielectric loss tangent*3 in high frequencies down to 0.0025, the global best level for polyimide film. This was achieved using the advanced polyimide development technologies that ...